Another day, another peek at new details on Sony's next-generation PlayStation 5 console since the PS5 Hardware Tech Specs revealed last month and the recent unveiling of the DualSense PS5 Wireless Controller... this time a PS5 Heatsink Patent surfaced at the USPTO bringing us a bit closer to the 2020 Holiday Launch. 
To quote from PSU.com on the find: From what we can tell, it seems like manufacturers are looking to place the heatsink on the opposite side of the board, which may include holes to accommodate the PS5’s cooling system.
Here's a description included with the patent: A heatsink (21) is disposed on a lower surface of a circuit board (10). The circuit board (10) has through holes (h1) that penetrate the circuit board (10) in an area (A) where an integrated circuit apparatus (5) is disposed. Heat conduction paths (11) are provided in the through holes (h1).
The heat conduction paths (11) connect the integrated circuit apparatus 5 and the heatsink (21). This structure allows for disposition of a component different from the heatsink (21) on the same side as the integrated circuit apparatus (5), thus ensuring a higher degree of freedom in a component layout.
Stay tuned to the PlayStation 5 Forums for more PS5 News as it develops, and cheers to @HydrogenNGU for the heads-up also!
To quote from PSU.com on the find: From what we can tell, it seems like manufacturers are looking to place the heatsink on the opposite side of the board, which may include holes to accommodate the PS5’s cooling system.
Here's a description included with the patent: A heatsink (21) is disposed on a lower surface of a circuit board (10). The circuit board (10) has through holes (h1) that penetrate the circuit board (10) in an area (A) where an integrated circuit apparatus (5) is disposed. Heat conduction paths (11) are provided in the through holes (h1).
The heat conduction paths (11) connect the integrated circuit apparatus 5 and the heatsink (21). This structure allows for disposition of a component different from the heatsink (21) on the same side as the integrated circuit apparatus (5), thus ensuring a higher degree of freedom in a component layout.
Stay tuned to the PlayStation 5 Forums for more PS5 News as it develops, and cheers to @HydrogenNGU for the heads-up also!
